Title:
SUBSTRATE TREATMENT DEVICE
Document Type and Number:
Japanese Patent JP2016117137
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To reduce a size of a substrate treatment device.SOLUTION: A substrate treatment device is provided with a polishing area in which at least one polishing module is arranged, a cleaning area in which at least one cleaning module and one drying module are arranged, and a conveyance mechanism in which a part of it is arranged above the polishing module, at least other part of it is arranged above the cleaning module and/or drying module, and a treated substrate is conveyed from the polishing area to the cleaning area.SELECTED DRAWING: Figure 1
Inventors:
ISHIBASHI TOMOATSU
Application Number:
JP2014258969A
Publication Date:
June 30, 2016
Filing Date:
December 22, 2014
Export Citation:
Assignee:
EBARA CORP
International Classes:
B24B41/06; B24B37/34; H01L21/304; H01L21/677
Domestic Patent References:
| JP2013116532A | 2013-06-13 | |||
| JP2001345292A | 2001-12-14 | |||
| JP2004330338A | 2004-11-25 | |||
| JP2003236744A | 2003-08-26 | |||
| JP2010264550A | 2010-11-25 | |||
| JP2011029240A | 2011-02-10 |
Attorney, Agent or Firm:
Seiji Ohno
Kobayashi Hideyoshi
Koji Morita
Shinji Kato
Mamoru Suzuki
Osamu Tsuda
Matsuno Chihiro
Kobayashi Hideyoshi
Koji Morita
Shinji Kato
Mamoru Suzuki
Osamu Tsuda
Matsuno Chihiro
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