SUBSTRATE PROCESSING DEVICE

Japanese Patent JP3442219

B2

PROBLEM TO BE SOLVED: To prevent processing liquid from dripping around a substrate carry in entrance or a substrate carry out exit by attaching to shutter a hood member that covers the number surface of the ceiling part of the substrate carry in entrance or the substrate carry out exit of a processing chamber from downward.
SOLUTION: A substrate cleaning device 1 that cleans substrates sheet by sheet while supplying processing liquid for the cleaning of substrate such as chemicals or pure water to a substrate W. A hood member 12 that the lower surface of the ceiling part 8a of the substrate carry in entrance 8 from downward is attached to a shutter 11 that opens and loses the substrate carry in entrance 8a. On carrying in of the substrate, the substrate W goes under the ceiling part 8s of the substrate in entrance 8 where no dew is condensed nor the processing liquid is adhered and the dripping of the processing liquid to the substrate W around the substrate carry in entrance 8 is prevented. The similar effect is obtained when the hood member 12 that covers the number surface of the ceiling part 9a of the substrate carry out exit 9 is attached to the shutter 11 that opens or closes the substrate carry out exit 9.

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JP2006202906	ETCHING APPARATUS AND ETCHING METHOD
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Nobuyuki Hirai
Kaoru Niihara
Akira Izumi

JP10473096A

September 02, 2003

April 01, 1996

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Dainippon Screen Mfg. Co., Ltd.

H01L21/306; H01L21/027; H01L21/304; (IPC1-7): H01L21/304; H01L21/027; H01L21/306

JP7180094A

Tsutomu Sugitani

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