Title:
Substrate processing device
Document Type and Number:
Japanese Patent JP6030859
Kind Code:
B2
Abstract:
A joint member that includes a cylindrical sleeve member having a first outer diameter portion having a first outer diameter and a second outer diameter portion having a second outer diameter smaller than the first outer diameter. The joint member further includes a cylindrical nut member having an inner peripheral surface on which a first thread is formed and a bottom in which an opening is formed. The joint member further includes a limit member fixed to an outer periphery portion of the second outer diameter portion inserted into the opening and in contact with an outer surface of the bottom of the cylindrical nut member.
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Inventors:
Izumi Sato
Shusuke Konno
Tomoyuki Nagata
Shusuke Konno
Tomoyuki Nagata
Application Number:
JP2012130202A
Publication Date:
November 24, 2016
Filing Date:
June 07, 2012
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
F16L19/025; F16L19/03; F16L49/06
Domestic Patent References:
JP20107747A | ||||
JP61201983A | ||||
JP2010169172A | ||||
JP9269089A | ||||
JP2009224765A | ||||
JP2009224504A | ||||
JP2007278341A |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito