Title:
基板処理装置
Document Type and Number:
Japanese Patent JP6606017
Kind Code:
B2
Abstract:
It is an object of the present invention to provide a high-flatness substrate holding table. According to a first aspect, a substrate processing apparatus is provided, and such a substrate processing apparatus includes a table for holding a substrate, a resin film attached to a top surface of the table and a heater provided inside the table, and the top surface of the table is formed of ceramics, the top surface of the table includes an opening connectable to a vacuum source, the resin film is formed of polyimide, and a through hole is formed at a position corresponding to the opening of the table when attached to the top surface of the table.
Inventors:
Warm new
Toru Maruyama
Nobuyuki Takahashi
Sakukawa Takashi
Youichi Shiokawa
Keita Yagi
Takeki Kobata
Tomohiko Takeuchi
Toru Maruyama
Nobuyuki Takahashi
Sakukawa Takashi
Youichi Shiokawa
Keita Yagi
Takeki Kobata
Tomohiko Takeuchi
Application Number:
JP2016113501A
Publication Date:
November 13, 2019
Filing Date:
June 07, 2016
Export Citation:
Assignee:
Ebara Corporation
International Classes:
B24B37/30; B24B41/06; B24B49/14; H01L21/304
Domestic Patent References:
| JP2008134204A | ||||
| JP2006015457A | ||||
| JP2013230509A |
Attorney, Agent or Firm:
Shinjiro Ono
Toru Miyamae
Yukio Kanegae
Makoto Watanabe
Toru Miyamae
Yukio Kanegae
Makoto Watanabe