Title:
基材処理装置および検出方法
Document Type and Number:
Japanese Patent JP6891083
Kind Code:
B2
Abstract:
A base material processing apparatus includes a first edge sensor, a second edge sensor, and a displacement amount calculation part. The first edge sensor acquires a first detection result (R1) by detecting the position of an edge of a base material in the width direction at a first detection position. The second edge sensor acquires a second detection result (R2) by detecting the position of the edge of the base material in the width direction at a second detection position. The displacement amount calculation part calculates the amount of displacement in the position of the base material in the transport direction on the basis of the first detection result (R1) and the second detection result (R2). Accordingly, the amount of displacement in the position of the base material in the transport direction can be detected without depending on images such as register marks.
Inventors:
Mitsuhiro Yoshida
Yuichi Hanada
Yuichi Hanada
Application Number:
JP2017183299A
Publication Date:
June 18, 2021
Filing Date:
September 25, 2017
Export Citation:
Assignee:
Screen Holdings Co., Ltd.
International Classes:
B41J2/01; B65H26/02
Domestic Patent References:
| JP5280936A | ||||
| JP2016088654A | ||||
| JP2012194361A | ||||
| JP2012006349A | ||||
| JP2016087798A | ||||
| JP2019042969A | ||||
| JP2017067823A | ||||
| JP2013136245A | ||||
| JP2013125011A | ||||
| JP200733537A | ||||
| JP9020002A | ||||
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Foreign References:
| US20090016785 |
Attorney, Agent or Firm:
Takami Nishida