Title:
基板処理装置、半導体装置の製造方法および基板処理装置の電極
Document Type and Number:
Japanese Patent JP6966402
Kind Code:
B2
Abstract:
There is provided a substrate processing apparatus, comprising: a reaction tube in which a substrate is processed; and a plurality of electrodes including a plurality of first electrodes to which a predetermined potential is applied and at least one second electrode to which a reference potential is applied. The at least one second electrode is arranged to be sandwiched between two sets of two or more continuously arranged electrodes of the plurality of first electrodes.
Inventors:
Takeda Tsuyoshi
Daisuke Hara
Daisuke Hara
Application Number:
JP2018169453A
Publication Date:
November 17, 2021
Filing Date:
September 11, 2018
Export Citation:
Assignee:
Kokusai electric inc.
International Classes:
H01L21/31; C23C16/50; H05H1/46
Domestic Patent References:
| JP2018107304A | ||||
| JP2017520080A | ||||
| JP2010013676A |
Foreign References:
| WO2018055700A1 |
Attorney, Agent or Firm:
Polaire Patent Business Corporation