Title:
基板処理装置及び半導体デバイスの製造方法
Document Type and Number:
Japanese Patent JP5214778
Kind Code:
B2
Inventors:
Takaaki Noda
Atsushi Moriya
Atsushi Moriya
Application Number:
JP2011160457A
Publication Date:
June 19, 2013
Filing Date:
July 22, 2011
Export Citation:
Assignee:
Hitachi Kokusai Electric Co., Ltd.
International Classes:
H01L21/205; C23C16/02; C23C16/44; C30B25/02; C30B25/18; C30B29/52
Domestic Patent References:
| JP9320970A | ||||
| JP2002118118A | ||||
| JP200337105A |
Attorney, Agent or Firm:
Patent Business Corporation IPS