Title:
基板処理装置、半導体装置の製造方法およびプログラム
Document Type and Number:
Japanese Patent JP6994060
Kind Code:
B2
Abstract:
To provide a structure of a substrate processing apparatus which can support the change of the number of processing of a product substrate requiring a device modification.SOLUTION: A substrate processing apparatus 100 comprises: a pod transfer mechanism 118 having a support part on which a substrate container 110 is mounted and a pod elevator 118a lifting the support part; a rotational type storage shelf 105 having a mounting part 117 on which the substrate container is mounted and a lifting driving part that lifts a mounting part to an inside and an outside within a lifting range of the support part; and a control part that controls the pod transfer mechanism 118 and the rotational type storage shelf 105 so that the substrate container 110 is received and transferred between the mounting part 117 and the support part by lifting the mounting part from the outside of the lifting range of the support part to the inside of the lifting range by the lifting driving part of the rotational type storage shelf 105.SELECTED DRAWING: Figure 2
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Inventors:
Hayashi Akinari
Application Number:
JP2020013815A
Publication Date:
January 14, 2022
Filing Date:
January 30, 2020
Export Citation:
Assignee:
KOKUSAI ELECTRIC Inc.
International Classes:
H01L21/677; C23C16/44; C23C16/458; H01L21/31
Domestic Patent References:
| JP2000124301A | ||||
| JP2011006222A | ||||
| JP2011181817A |