基板処理装置、基板処理方法、および記録媒体

Title:

基板処理装置、基板処理方法、および記録媒体

Document Type and Number:

Japanese Patent JP4815274

Kind Code:

B2

More Like This:

JP6530303	Chemical mechanical polishing slurry to reduce corrosion and how to use it
JP2021008026	LOW-DEBRIS FLUOROPOLYMER COMPOSITE CMP POLISHING PAD
JP4367587	Cleaning method

Inventors:

Kazuhisa Matsumoto

Application Number:

JP2006159939A

Publication Date:

November 16, 2011

Filing Date:

June 08, 2006

Export Citation:

Assignee:

東京エレクトロン株式会社

International Classes:

H01L21/304; B08B3/02; H01L21/027; H01L21/306

Domestic Patent References:

Attorney, Agent or Firm:

Kenji Yoshitake
Hiroyuki Nagai
Junpei Okada
Hirohito Katsunuma
Yukihiro Hotta

Previous Patent: JPS4815273

Next Patent: JPS4815275