Title:
基板処理装置および基板処理方法
Document Type and Number:
Japanese Patent JP6847726
Kind Code:
B2
Abstract:
A substrate processing apparatus includes a processing liquid distributing member that partitions, by an inner wall surface, at least part of a processing liquid distribution passage communicating with a discharge port, a processing liquid supplying unit that supplies the high-temperature processing liquid having a higher temperature than a room temperature to the processing liquid distribution passage, a temperature changing unit arranged to heat or cool an outer wall surface of the processing liquid distributing member from the outside to change a temperature of the processing liquid distributing member, and a controller that executes an equilibrium temperature maintaining step of maintaining the inner wall surface of the processing liquid distributing member at a thermal equilibrium temperature by controlling the temperature changing unit in a state where no processing liquid is supplied from the processing liquid supplying unit to the processing liquid distribution passage.
Inventors:
Mitsuharu Hashimoto
Naoyuki Osada
Naoyuki Osada
Application Number:
JP2017060046A
Publication Date:
March 24, 2021
Filing Date:
March 24, 2017
Export Citation:
Assignee:
Screen Holdings Co., Ltd.
International Classes:
H01L21/306; H01L21/304
Domestic Patent References:
| JP2016167568A | ||||
| JP2017011033A | ||||
| JP2003297739A | ||||
| JP2011077145A | ||||
| JP2010130024A |
Attorney, Agent or Firm:
Patent Business Corporation Ai Patent Office