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Title:
基板処理装置および基板処理方法
Document Type and Number:
Japanese Patent JP7451324
Kind Code:
B2
Abstract:
A substrate processing apparatus which reliably prevents a cleaning liquid containing foreign particles from falling from a polishing head onto a substrate is disclosed. The substrate processing apparatus includes a rotating and holding mechanism, a polishing head, and a head cleaning device configured to supply the cleaning liquid to the polishing head to clean the polishing head during polishing and/or after polishing of the substrate.

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Inventors:
Hokuto Yamanobe
Application Number:
JP2020110491A
Publication Date:
March 18, 2024
Filing Date:
June 26, 2020
Export Citation:
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Assignee:
Ebara Corporation
International Classes:
H01L21/304; B24B1/04; B24B9/00; B24B55/08
Domestic Patent References:
JP2007524231A
JP2009154285A
JP2017011083A
Attorney, Agent or Firm:
Tetsuya Hirosawa
Isamu Watanabe
Goto Manabu
Mitsuhiro Kanazawa



 
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