Title:
基板処理装置
Document Type and Number:
Japanese Patent JP7148610
Kind Code:
B2
Abstract:
Disclosed herein is an apparatus for processing a substrate using an inductively coupled plasma source. An inductively coupled plasma source utilizes a power source, a shield member, and a coil coupled to the power source. In certain embodiments, the coils are arranged with a horizontal spiral grouping and a vertical extending helical grouping. The shield member, according to certain embodiments, utilizes a grounding member to function as a Faraday shield. The embodiments herein reduce parasitic losses and instabilities in the plasma created by the inductively coupled plasma in the substrate processing system.
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Inventors:
Rogers James
Polowes John
Polowes John
Application Number:
JP2020531430A
Publication Date:
October 05, 2022
Filing Date:
July 10, 2018
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
H05H1/46
Domestic Patent References:
| JP2012033960A | ||||
| JP2016143616A | ||||
| JP2005011799A | ||||
| JP10256238A | ||||
| JP8339897A | ||||
| JP2011253916A | ||||
| JP9097783A | ||||
| JP2014239210A |
Foreign References:
| US20150191823 | ||||
| CN104302084A | ||||
| US20160049279 | ||||
| US20070181257 |
Attorney, Agent or Firm:
Yoshiaki Anzai
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