To prevent the adhesion of a treating liquid removed from substrates to the substrates again by arranging the divided cup bodies of specific shape in the circumferential direction of the rotation of a substrate holding base at predetermined intervals, in the treatment of the surfaces of substrates as the semiconductor substrate with the treating liquid rotating them.
Eight divided cup bodies 23 to 30 arranged around a substrate holding base 15 are arranged at predetermined intervals so that the back edge parts 23a of the upstream side divided cup body 23 is overlapped with the front edge part 24a of the downstream side divided cup body 24 radially. A substrate 17 is held by a substrate holding base 15 with a supporting pin 16, the substrate holding base 15 together with substrates 17 is rotated by a driving means at the fast speed of 900-1,500 rpm to eject the treating liquids as a cleansing liquid and a developing liquid on the substrates 17 carried by air flow generated by the rotation of the substrate holding base 15. Ejected treating liquid 32 is guided on the back surface side of the neighboring divided cup body along the wall face of the divided cup bodies 23 to 30, dropped into a waste liquid collecting case at low part and collected.
YOSHIDA KAZUO
MUTA MARI
KUME SATOSHI
ADVANCED DISPLAY KK