To provide a substrate processing equipment which performs a series of processes on a substrate at a high efficiency without increasing the length of a substrate transfer distance.
A substrate processing equipment is provided with a processing part 2, which has a plurality of processing units for performing a series of processes, i.e., development of a target substrate S after resist coating and exposure and etching of the developed substrate S, on the both sides of transfer paths 12, 13, 14, major transfer equipment 17, 18, 19 that shifts along the transfer paths 12, 13, 14 and transfer the substrate between processing units, and a carry in/out part 1 having a transfer mechanism 11 for transferring the substrate S to and from the major transfer equipment 17, 18, 19. Respective processing units of the processing parts 2, the transfer paths 12, 13, 14 and the carry in/out part 1 are integrally arranged.
TAKAMORI HIDEYUKI
HARA KOZO
