Title:
基板処理方法および半導体装置の製造方法
Document Type and Number:
Japanese Patent JPWO2003056622
Kind Code:
A
Inventors:
Masaru Sasaki
Matsuyama 征嗣
Takuya Sugawara
Matsuyama 征嗣
Takuya Sugawara
Application Number:
JP2002013550W
Publication Date:
July 10, 2003
Filing Date:
December 25, 2002
Export Citation:
Assignee:
Tokyo Electron, Ltd.
International Classes:
(IPC1-7): H01L21/322; H01L27/108; H01L29/78; H01L21/8242; H01L21/324; H01L21/336; H01L29/786
Attorney, Agent or Firm:
Tadahiko Ito
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