Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
Japanese Patent JP2022185240
Kind Code:
A
Abstract:
To provide a substrate processing method and a substrate processing apparatus that are capable of inhibiting the generation of particles onto a substrate.SOLUTION: A substrate processing method is a substrate processing method including processing a substrate by supplying chemical liquid from a nozzle of a chemical liquid supply unit while rotating the substrate and includes: a first step of detecting air bubbles generated in the chemical liquid in a passage of the chemical liquid supply unit; a second step of acquiring a discharge period in which the air bubbles in the chemical liquid detected in the first step are to be discharged from the nozzle; and a third step of changing the position of the nozzle with respect to the substrate on the basis of the discharge period.SELECTED DRAWING: Figure 10
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Inventors:
FUJITA HIROMI
Application Number:
JP2021092774A
Publication Date:
December 14, 2022
Filing Date:
June 02, 2021
Export Citation:
Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/306; H01L21/304
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Junji Kashiwaoka
Shigeki Matsuo
Toshiaki Matsuzawa
Yoshiki Kuroki
Junji Kashiwaoka
Shigeki Matsuo
Toshiaki Matsuzawa
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