Title:
基板処理方法及び基板処理装置
Document Type and Number:
Japanese Patent JP7195060
Kind Code:
B2
Abstract:
There is provided a method of processing a substrate by a substrate processing apparatus including a substrate mounting table having a refrigerant passage and a heater, and a chiller. The method includes adjusting a temperature of the substrate mounting table to a first temperature to process the substrate; and adjusting the temperature of the substrate mounting table to a second temperature higher than the first temperature to process the substrate. The temperature of the substrate mounting table becomes the second temperature by allowing the refrigerant at a first flow rate to flow from the chiller to the refrigerant passage and operating the heater. The temperature of the substrate mounting table becomes the first temperature by allowing the refrigerant at a second flow rate larger than the first flow rate to flow from the chiller to the refrigerant passage and operating the heater, or stopping an operation of the heater.
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Inventors:
Takashi Mochizuki
Toshiaki Fujisato
Toshiaki Fujisato
Application Number:
JP2018095727A
Publication Date:
December 23, 2022
Filing Date:
May 17, 2018
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/3065; H01L21/683
Domestic Patent References:
| JP10144655A | ||||
| JP2008235309A | ||||
| JP2016528723A | ||||
| JP2017208469A | ||||
| JP2008235311A | ||||
| JP2010010397A | ||||
| JP2011086712A |
Foreign References:
| US20090321017 |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito