Title:
基板処理方法及び基板処理装置
Document Type and Number:
Japanese Patent JP7300898
Kind Code:
B2
Abstract:
A substrate processing method in substrate processing apparatus comprises repeating cycle including: supplying source gas into process container causing the source gas to be adsorbed to substrate; exhausting excess source gas from the process container; supplying reaction gas into the process container causing the reaction gas to react with the source gas; and exhausting excess reaction gas, wherein at least one of a gap width between placement stage and member forming processing space between the member and the stage and degree of opening of pressure adjustment valve in at least one of the supplying the source gas and the supplying the reaction gas is smaller than at least one of a gap width between the stage and the member and the degree of opening of the pressure adjustment valve in at least one of the exhausting the excess source gas and the exhausting the excess reaction gas, respectively.
Inventors:
Takeshi Takahashi
Mitsuhiro Okada
Yasushi Fujii
Hiroshi Nunoshige
Shinji Kawasaki
Hirotake Kuwata
Toshio Takagi
Mitsuhiro Okada
Yasushi Fujii
Hiroshi Nunoshige
Shinji Kawasaki
Hirotake Kuwata
Toshio Takagi
Application Number:
JP2019108977A
Publication Date:
June 30, 2023
Filing Date:
June 11, 2019
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
C23C16/455; C23C16/44; C23C16/52; H01L21/285; H01L21/768
Domestic Patent References:
| JP2011060936A | ||||
| JP2017005016A | ||||
| JP2018150612A | ||||
| JP2006283172A |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito