Title:
基板処理方法及び基板処理装置
Document Type and Number:
Japanese Patent JP7304188
Kind Code:
B2
Abstract:
A method of processing a substrate includes: a placement step of placing the substrate on an electrostatic chuck set to have a predetermined temperature; a first attraction step of attracting the substrate onto the electrostatic chuck by applying a first direct current (DC) voltage to the electrostatic chuck; a holding step of holding the attraction of the substrate by the electrostatic chuck while applying the first DC voltage to the electrostatic chuck, until a temperature difference between the electrostatic chuck and the substrate becomes 30 degrees C. or less; and a second attraction step of attracting the substrate onto the electrostatic chuck by applying a second DC voltage, which is higher than the first DC voltage, to the electrostatic chuck.
Inventors:
▲高▼橋 徹
Hiroshi Tsujimoto
Nobuaki Shindo
Shigeru Yoneda
Hiroshi Tsujimoto
Nobuaki Shindo
Shigeru Yoneda
Application Number:
JP2019066999A
Publication Date:
July 06, 2023
Filing Date:
March 29, 2019
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/683; H01L21/3065
Domestic Patent References:
| JP2000012664A | ||||
| JP2000021964A | ||||
| JP2002009141A | ||||
| JP2001152335A | ||||
| JP2011198838A | ||||
| JP2012174978A |
Attorney, Agent or Firm:
Tetsuo Kanemoto
Koji Hagiwara
Naoki Ogita
Takashi Saito
Takuya Mine
Koji Hagiwara
Naoki Ogita
Takashi Saito
Takuya Mine