SUBSTRATE PROCESSING METHOD

Japanese Patent JP2016020278

A

PROBLEM TO BE SOLVED: To provide a substrate processing method by which management burden of a substrate during transportation can be reduced.SOLUTION: According to a substrate processing method, a processing part is provided in a chamber equipped with a first part which is provided on a movement route in a longer direction of a substrate and is located on a first surface side of the substrate, a second part which is so located on a second surface side of the substrate as to be relatively separably connected to the first part, and a passing part which can pass the substrate in the longer direction in the state that the first part and the second part are connected to each other, the substrate is so moved in a width direction crossing the longer direction that the substrate is transported into a space formed by separation of the first part and the second part of the chamber, the first part and the second part of the chamber are connected to each other in the state that the substrate is positioned in the space thereby adjusting the interior of the chamber to a specified environment, and the substrate is processed by the processing part under the specified environment.SELECTED DRAWING: Figure 1

HAMADA TOMOHIDE
KIUCHI TORU

JP2015142284A

February 04, 2016

July 16, 2015

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NIKON CORP

B65H20/00; B05B14/30; B65G49/00; G02F1/13; G03F7/20; H01L21/027; H01L21/677

JP2000303178A	2000-10-31
JPS5934668A	1984-02-25
JP2002035982A	2002-02-05
JP2000303178A	2000-10-31
JPS5934668A	1984-02-25
JP2002035982A	2002-02-05

Masatake Shiga
Tadashi Takahashi

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