Title:
基板処理方法
Document Type and Number:
Japanese Patent JP4562152
Kind Code:
B2
Abstract:
A substrate treatment process includes plural steps of delivering a long substrate with application of tensile force to the substrate, wherein the strength of the tensile force is changed at least between a first delivery step and a second delivery step. This process prevents enlargement of edge waviness of a belt-shaped substrate to stabilize the plasma discharge.
Inventors:
Masatoshi Tanaka
Hirokazu Otoshi
Yasuyoshi Takai
Hirokazu Otoshi
Yasuyoshi Takai
Application Number:
JP2000210603A
Publication Date:
October 13, 2010
Filing Date:
July 11, 2000
Export Citation:
Assignee:
Canon Inc
International Classes:
C23C14/56; C23C16/44; B21D3/12; H01L21/203; H01L21/205; H01L31/00; H01L31/0392; H01L31/04; H01L31/075; H01L31/076; H01L31/077; H01L31/18; H01L31/20
Domestic Patent References:
| JP6215372A | ||||
| JP2000204477A |
Attorney, Agent or Firm:
Tatsuya Nagao