Title:
基板処理方法
Document Type and Number:
Japanese Patent JP7313208
Kind Code:
B2
Abstract:
To provide a substrate processing apparatus and a substrate processing method capable of easily improving the in-plane uniformity of processing.SOLUTION: A substrate processing apparatus includes a substrate rotating portion that holds and rotates a substrate, a processing liquid discharge portion that discharges processing liquid toward the rotating substrate, and a cooling gas discharge portion that discharges cooling gas to N points (N is an integer of 2 or more) in the radial direction of the rotating substrate.SELECTED DRAWING: Figure 2
Inventors:
Takashi Nakazawa
Application Number:
JP2019119027A
Publication Date:
July 24, 2023
Filing Date:
June 26, 2019
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/304
Domestic Patent References:
| JP2016063093A | ||||
| JP2010067819A | ||||
| JP2016157854A | ||||
| JP2018164012A |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito
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