Title:
基板処理システム及び基板処理方法
Document Type and Number:
Japanese Patent JP7303678
Kind Code:
B2
Abstract:
A substrate processing system includes: a substrate transfer device; processing units each having a substrate holding mechanism for rotatably holding a substrate received from the substrate transfer device and a processing fluid supply part for supplying a processing fluid to the substrate; and a controller for controlling the substrate transfer device and the processing units according to processing recipe information so as to execute the substrate processing process. When an abnormality in a certain unit of the processing units occurs in the substrate processing process for the substrate to be processed, the controller controls the substrate transfer device and a relief processing unit according to complementary recipe information so that the complementary processing process for a relief substrate is executed in the relief processing unit by transferring the relief substrate to the relief processing unit different from the certain processing unit.
Inventors:
Yuji Takimoto
Application Number:
JP2019126958A
Publication Date:
July 05, 2023
Filing Date:
July 08, 2019
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/304
Domestic Patent References:
| JP2009200476A | ||||
| JP2006203145A | ||||
| JP2017011159A | ||||
| JP2001093791A | ||||
| JP2010140978A |
Foreign References:
| US20090186557 | ||||
| CN101494164A | ||||
| US20060162660 | ||||
| CN1819112A | ||||
| US6795745 | ||||
| US20100144145 |
Attorney, Agent or Firm:
Hiroyuki Nagai
Yukitaka Nakamura
Satoru Asakura
Hideyuki Mori
Taku Murakoshi
Yukitaka Nakamura
Satoru Asakura
Hideyuki Mori
Taku Murakoshi