To provide a substrate holding structure capable of reducing deformation of a substrate, especially a large-sized substrate.
A method and an apparatus are provided for holding the substrate having a holding frame 54 capable of minimizing deformation during thermal expanding in a processing chamber. In one embodiment, the holding frame 54 has one or more longitudinal members 84 connected to one or more transverse members 86a. The transverse member 86a preferably demarcates a holding surface on which a heated susceptor is mounted. The longitudinal member 84 is preferably disposed at a portion lower than the heated susceptor, resulting in minimizing thermal expansion of the longitudinal member. A spacer 9 formed of a thermally conductive member is disposed at a suitable place along the member, resulting in making thermal distribution of the member uniform.
LALLY CHAN
BEER EMANUEL
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