Title:
SUBSTRATE-PROVIDED ADHESIVE, MANUFACTURING METHOD OF SUBSTRATE-PROVIDED ADHESIVE, AND CIRCUIT CONNECTING STRUCTURE USING THE ADHESIVE
Document Type and Number:
Japanese Patent JP2005206717
Kind Code:
A
Abstract:
To obtain a substrate-provided adhesive which can keep stable adhesion and electrical connection even after the attaching with the adhesive is performed and the mechanical fixing between adherends is conducted, and to obtain a manufacturing method of the substrate-provided adhesive and a circuit connecting structure using it.
The substrate-provided adhesive is one of a three-layer type wherein on a substrate (A) the adhesive is disposed and further a film (B) is disposed. The face in contact with the adhesive, of the film (B) has a surface roughness in the range of 0.1-1 μm in terms of arithmetic mean roughness Ra and a maximum height Ry in the range of 1-10 μm.
Inventors:
YOKOSUMI TOMOMI
SATO KAZUYA
SEKI GENTARO
TO GYOREI
YUSA MASAMI
SATO KAZUYA
SEKI GENTARO
TO GYOREI
YUSA MASAMI
Application Number:
JP2004015563A
Publication Date:
August 04, 2005
Filing Date:
January 23, 2004
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09J7/02; C09J4/00; C09J11/06; C09J163/00; C09J171/10; C09J201/00; H01R11/01; H01R43/00; H05K1/14; (IPC1-7): C09J171/10; C09J4/00; C09J7/02; C09J11/06; C09J163/00; C09J201/00; H01R11/01; H01R43/00
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