To improve the joining strength between a resin layer and a substrate by using an intermediate layer of a new structure in a substrate resin laminated structure in which the resin layer is laminated on the surface of the substrate such as a Si substrate.

A surface-modified film 15 (SiO2 heat-oxidized film) is formed on the surface of the Si substrate 12 by heat oxidation etc. At least one oxidized film 16 (SiOx film) is formed on the surface-modified film 15 by a spatter or CVD, and the resin layer is formed on the oxidized film 16. The density of the oxidized film 16 is greater than that of the surface-modified film 15.