Title:
SUBSTRATE RINSE LIQUID AND SUBSTRATE TREATMENT METHOD
Document Type and Number:
Japanese Patent JP2002050606
Kind Code:
A
Abstract:
To provide substrate rinse liquid which restrains attaching of metals during ultra-pure water rinse of a substrate, where a metallic wiring is formed, and to provide a substrate washing treatment method for restraining attaching of the metals.
The substrate rinse liquid consists of ultra-pure water, comprising chelating agent of free acid or ammonium salt at 100 mg/L or less. After a treatment including a process for making chemical or abrasive liquid function is performed for the surface of a substrate, the substrate is rotated and rinse treatment for removing chemical or contaminant from the surface is applied by means of substrate rinse liquid consisting of ultra-pure water comprising chelating agent of free acid or ammonium salt.
Inventors:
ONO HARUKO
FUKUNAGA AKIRA
KATAKABE ICHIRO
KIHARA SACHIKO
FUKUNAGA AKIRA
KATAKABE ICHIRO
KIHARA SACHIKO
Application Number:
JP2000233252A
Publication Date:
February 15, 2002
Filing Date:
August 01, 2000
Export Citation:
Assignee:
EBARA CORP
International Classes:
B24B57/02; B24B37/00; C11D7/26; C11D7/32; C11D7/60; H01L21/304; (IPC1-7): H01L21/304; B24B37/00; B24B57/02; C11D7/26; C11D7/32; C11D7/60
Attorney, Agent or Firm:
Takashi Kumagai (1 outside)