Title:
SUBSTRATE SCREENING DEVICE AND SUBSTRATE SCREENING METHOD
Document Type and Number:
Japanese Patent JP3967089
Kind Code:
B
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate screening device for removing a substrate having a risk of cracking or chipping at the time of executing a prescribed processing to the substrate before feeding it to a manufacture line.
SOLUTION: The substrate screening device is provided with a stress adding means 13, a microcrack detecting means 14 and a normal/defective article sorting means 15. The stress adding means 13 adds prescribed stress to a non- worked substrate before being fed to the manufacture line. The microcrack detecting means 14 gives an impact to the substrate after the stress is added, captures sound generated by the substrate and detects the presence/absence of the damage of the substrate. The normal/defective article sorting means 15 sorts the substrates on the basis of information obtained by the microcrack detecting means 14.
More Like This:
Inventors:
Hara, Shoichiro
Kawasaki, Takafumi
Murayama, Hideyuki
Sasai, Hiroyuki
Kawasaki, Takafumi
Murayama, Hideyuki
Sasai, Hiroyuki
Application Number:
JP2001000141349
Publication Date:
June 08, 2007
Filing Date:
May 11, 2001
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
G01N29/12; H01L31/04; G01M7/02; G01N29/12; H01L31/04; G01M7/00; (IPC1-7): H01L31/04; G01M7/02; G01N29/12
Previous Patent: SEMICONDUCTOR LIGHT EMITTING DEVICE AND ITS MANUFACTURING METHOD
Next Patent: MOVING METHOD FOR VOID INSIDE OF TRANSPARENT SOLID
Next Patent: MOVING METHOD FOR VOID INSIDE OF TRANSPARENT SOLID