SUBSTRATE STRUCTURE OF BUILDING WALL SURFACE, FOR SETTING SCAFFOLDING THEREON, AND METHOD FOR FORMING SUBSTRATE FOR SETTING SCAFFOLDING THEREON

Title:

SUBSTRATE STRUCTURE OF BUILDING WALL SURFACE, FOR SETTING SCAFFOLDING THEREON, AND METHOD FOR FORMING SUBSTRATE FOR SETTING SCAFFOLDING THEREON

Document Type and Number:

Japanese Patent JP2003020790

Kind Code:

A

Abstract:

To provide a substrate structure of a building wall surface, for setting scaffolding thereon, which facilitates setting of a wall tie for preventing toppling of the scaffolding, on an outer wall of a building, and dispenses with water-proofing with putty after removal of the scaffolding.

According to the substrate structure, a tapping screw 8 is inserted into a cylindrical sealing material 6 and a stainless steel cylinder 7, and its tip screw portion is screwed into a screw hole 5 in a wall substrate steel frame 3. When a head of the tapping screw 8 is protruded from a joint surface, the protruded portion serves as an engaging portion for engaging a wall tie receptacle 9. On the other hand, when the tapping screw 8 is screwed into the joint so as to be almost flush with the joint, the cylindrical sealing material 6 is compressed to be expanded, to thereby ensure sealing in a hole 4.

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Inventors:

HIROZAWA KENJI
TAKAHASHI SHUICHI
SONODA CHIE

Application Number:

JP2001204642A

Publication Date:

January 24, 2003

Filing Date:

July 05, 2001

Export Citation:

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Assignee:

DAIWA HOUSE IND
DAIWA GENERAL RES INST CO LTD

International Classes:

E04G5/04; (IPC1-7): E04G5/04

Attorney, Agent or Firm:

Taizo Jimbo

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