Title:
SUBSTRATE SUPPORT DEVICE, AND SUBSTRATE PROCESSING APPARATUS HAVING THE SAME
Document Type and Number:
Japanese Patent JP2015004131
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate support device capable of controlling a plasma distribution or density uniform on a substrate and surroundings of the substrate, and also controlling the plasma distribution or density uniform in a central area and a peripheral area of the substrate, and to provide a substrate processing apparatus having the same.SOLUTION: A substrate processing apparatus comprises: a chamber forming a processing space; a substrate susceptor arranged in the chamber for supporting a substrate; and an upper electrode arranged to face the substrate susceptor and to which RF power is applied. In order that a plasma to be formed between the upper electrode and the substrate susceptor is uniformly formed to the peripheral region of the substrate susceptor, the substrate susceptor is provided with a plurality of earth electrodes spaced apart each other and controlled individually.
Inventors:
PARK YONG GYUN
SEO TAE WOOK
LEE NAE IL
SEO TAE WOOK
LEE NAE IL
Application Number:
JP2014126443A
Publication Date:
January 08, 2015
Filing Date:
June 19, 2014
Export Citation:
Assignee:
WONIK IPS CO LTD
International Classes:
C23C16/509; H01L21/31; H05H1/46
Domestic Patent References:
| JP2011519117A | 2011-06-30 | |||
| JP2008244063A | 2008-10-09 | |||
| JP2006339391A | 2006-12-14 | |||
| JPH11176821A | 1999-07-02 | |||
| JP2006511059A | 2006-03-30 | |||
| JP2012004160A | 2012-01-05 | |||
| JP2012151504A | 2012-08-09 |
Attorney, Agent or Firm:
Patent business corporation MAEDA PATENT OFFICE
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