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Title:
基板支持台、及びプラズマ処理装置
Document Type and Number:
Japanese Patent JP7316179
Kind Code:
B2
Abstract:
There is provided a substrate support pedestal including: a first metallic member having a recess formed in an upper portion of the first metallic member; a second metallic member provided on the first metallic member and configured to seal the recess; a substrate support part provided on the second metallic member; and one or more thermoelectric elements disposed in the recess, wherein the recess is filled with a heat transfer medium.

Inventors:
Liang Sun
▲高▼橋 智之
Shinya Sasaki
Masaru Sasaki
Application Number:
JP2019183871A
Publication Date:
July 27, 2023
Filing Date:
October 04, 2019
Export Citation:
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Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/3065; H01L21/683; H05H1/46
Domestic Patent References:
JP2015008287A
JP11111823A
JP2004087205A
JP2016082077A
JP2015509280A
JP2006310374A
JP2010135450A
Foreign References:
KR1020190101036A
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Junji Kashiwaoka



 
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