To provide a substrate support unit, a single substrate polishing apparatus utilizing the unit, and a substrate polishing method utilizing the apparatus.
The substrate support unit is characterized in that, in a polishing step, the lower surface of the substrate is vacuum-adsorbed, and, in a post-washing step, the substrate is supported in such a state that the substrate faces upward and is spaced in order to wash the lower surface of the substrate. By the above constitution, a substrate support unit can successively perform a polishing step of polishing the upper surface of a substrate in such a state that the substrate is supported by a single substrate support unit and a post-washing step of, subsequent to the polishing step, washing the upper and lower surfaces of the substrate. Further there are provided a single substrate polishing apparatus utilizing the substrate support unit, and a substrate polishing method utilizing the apparatus.
CHOI KI-HOON
KOO GYO-WOOG
CHO JUNG-GUN
YOON CHANG-RO
SON DUK-HYUN
GOO SE-HUN
| JPH1154394A | 1999-02-26 | |||
| JPH10303110A | 1998-11-13 | |||
| JP2002208560A | 2002-07-26 | |||
| JPS6138863A | 1986-02-24 | |||
| JP2000294622A | 2000-10-20 | |||
| JPH06289625A | 1994-10-18 |
| WO2008048518A1 | 2008-04-24 |
Yoshishige Takeo
Takeshi Sakaguchi
Kyohei Tokioka
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