To provide a substrate-cleaning solution that can efficiently remove particulate contamination in comparison with the existing techniques in the production process for semiconductor devices and display devices and provide a method of cleaning the same.
The substrate surface-cleaning solution includes at least the following components (A), (B), (C) and (D), has a pH of ≥9, and has a content of the component (C) of 0.01-4 wt.%: (A) an ethylene oxide addition type surfactant having hydrocarbon groups which may be substituted as well as polyoxyethylene groups in the same molecular structure wherein the ratio (m/n) of the carbon atom number in the hydrocarbon groups (m) to the number of the oxyethylene groups (n) in the polyoxyethylene groups is ≤1.5; (B) alkali components; (C) hydrogen peroxide; (D) water.
MOCHIZUKI HIDEAKI
ITO ATSUSHI
JPS63274149A | 1988-11-11 | |||
JPH11121418A | 1999-04-30 | |||
JPH0613364A | 1994-01-21 | |||
JPH05138142A | 1993-06-01 | |||
JPH11162907A | 1999-06-18 | |||
JPH06177101A | 1994-06-24 |
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