Title:
基板表面保護膜用組成物及び基板の製造方法
Document Type and Number:
Japanese Patent JP5903831
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a composition for a substrate surface-protecting film, which is excellent in cracking resistance, is excellent in properties of embedding a fine unevenness deeply formed on MEMS and the like with a resin, and reduces the adhesion of the protecting film; and to provide a method of producing a substrate using the same.SOLUTION: A composition for a substrate surface-protecting film comprises: a phenolic resin that has a softening point, measured by a ring-and-ball method, of ≥140°C; a thermoplastic resin that has Tg of ≤70°C; and an organic solvent. In the composition, a content mass ratio of the phenolic resin and thermoplastic resin is 100:40 to 100:300, and viscosity at 25°C is 4 to 10,000 mPa s. A method of producing a substrate using the composition sequentially includes: a step of covering a front surface of a substrate for protection, the front surface having microfabricated unevenness; and a step of processing a back surface of the substrate.
Inventors:
Koji Watanabe
Masatoshi Fujimoto
Masatoshi Fujimoto
Application Number:
JP2011236285A
Publication Date:
April 13, 2016
Filing Date:
October 27, 2011
Export Citation:
Assignee:
Nagase Chemtex Co., Ltd.
International Classes:
C09D161/06; C09D7/47; C09D133/00; C09D201/00; H01L21/312
Domestic Patent References:
| JP2008138128A | ||||
| JP1236632A | ||||
| JP2010024342A |
Foreign References:
| WO2010073948A1 |
Attorney, Agent or Firm:
Shinya Furuya