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Title:
SUBSTRATE FOR SUSPENSION, SUSPENSION, SUSPENSION WITH HEAD, HARD DISK DRIVE AND MANUFACTURING METHOD FOR SUBSTRATE FOR SUSPENSION
Document Type and Number:
Japanese Patent JP2013182642
Kind Code:
A
Abstract:

To provide a substrate for suspension that is capable of improving reliability of electrical connection with an actuator element.

A substrate for suspension 1 according to the invention comprises an insulation layer 10, a metal support layer 11 and a wiring layer 12. Among these layers, the wiring layer 12 includes: multiple lines 13; and a wiring connection part 16 that is connected to the corresponding line 13 and is electrically connected to an actuator element 44 through a conductive adhesive. A connection structure region 3 includes a metal support layer through-hole 32 and an insulation layer through-hole 33, and is at least partially provided with an injection hole 31 where the conductive adhesive is injected. The metal support layer 11 includes a frame body part 17 that forms the metal support layer through-hole 32. The frame body part 17 includes an opposing face 17c that is arranged on a surface opposite to the insulation layer 10 and is opposed to the actuator element 44, and the opposing surface 17c of the frame body part 17 is provided with a groove 18.


Inventors:
NAGAYA TAKESHI
Application Number:
JP2012045749A
Publication Date:
September 12, 2013
Filing Date:
March 01, 2012
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
G11B5/60; G11B21/10; G11B21/21
Attorney, Agent or Firm:
Hirohito Katsunuma
Hiroyuki Nagai
Katsuomi Isogai
Yukihiro Hotta
Kazuya Yamashita