Title:
SUBSTRATE FOR TEST OF SEMICONDUCTOR CHIP
Document Type and Number:
Japanese Patent JPS5797638
Kind Code:
A
Abstract:
PURPOSE:To enable to make matching of characteristic impedance on the cable side and on the substrate side of a substrate for test of semiconductor chip when signal lines of the cable are to be connected to conductor patterns on the surface of the ceramic substrate and an earth line of the cable is to be connected to an earth layer on the back of the substrate by a method wherein permittivity and size thereof are regulated. CONSTITUTION:A window 16 is formed in an alumina substrate material (green sheet) 17 being not yet sintered, and pads 13 corresponding to input/output pads of a glass substrate to be received in the window 16, input/output terminals 12 to be connected to a tester, conductor patterns 11 to connect the pads 13 and the terminals 12 radially are provided. Then the green sheets are laminated and are sintered to form the ceramic substrate 10, and characteristic impedance thereof is controlled by regulating breadth of the pattern conductors 11 and the thickness of the green sheets 17.
Inventors:
YABE KATSUMI
KOBAYASHI FUMIYUKI
KOBAYASHI FUMIYUKI
Application Number:
JP17320480A
Publication Date:
June 17, 1982
Filing Date:
December 10, 1980
Export Citation:
Assignee:
HITACHI LTD
International Classes:
G01R1/073; G01R31/26; H01L21/66; (IPC1-7): H01L21/66
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