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Title:
SUBSTRATE TESTING MACHINE
Document Type and Number:
Japanese Patent JPS5729965
Kind Code:
A
Abstract:

PURPOSE: To simplify a pressure device and to make a testing machine small-sized, by preparing only the number of contacts which are required for executing one parts test, and executing their locate control independently.

CONSTITUTION: This testing machine is provided with a co-ordinate locating device 4 for locating each co-ordinate of contacts 1W3, a substrate fixing device 6 for fixing a printing substrate 5 to be tested, and a pressure device 7 for making each contact press-contact onto the substrate 5. In both ends of parts 8 to be measured are placed a source contact 1 and an input contact 2, and in a prescribed check point around the parts 8 is placed a guard contact 3. By a driving control of a pulse motor in the device 4, the contact 3 is located at an optional check point 5A, and the contacts 1, 2 are located to check points 5B, 5C relating to the parts 8. When each location has been completed, each contact is made to contact with the check points 5AW5C by prescribed pressure, and the parts 8 are tested.


Inventors:
KASHIWAGI TAKASHI
Application Number:
JP10467880A
Publication Date:
February 18, 1982
Filing Date:
July 30, 1980
Export Citation:
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Assignee:
TOKYO SHIBAURA ELECTRIC CO
International Classes:
G01R1/073; G01R31/28; (IPC1-7): G01R31/28



 
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