PURPOSE: To obtain a substrate for thermal head capable of high recording performance at low cost by processing an aluminum layer to alumite through anode oxidation and applying a heat-resistant layer in the thickness of 0.5W10μm on an area where at least a heat generating body is formed.
CONSTITUTION: An aluminum layer 12 of the thickness of less than 50μm is laminated on a small metal plate having a smaller coefficient of thermal expansion than aluminum. Then part or the entirety of the aluminum layer is oxidized to form a alumite layer by anode oxidation, and a heat-resistant resin membrane 14 is formed on at least, an area where a heat generating body is formed on the alumite coat. Next, any metal plate having a small coefficient of thermal expansion can be selected as a substrate. Even an IC for drive is directly mounted on the substrate, the reliability of the substrate does not deteriorate due to a difference between the coefficients of thermal expansion of the substrate and the IC fore drive. Thus the highly reliable thermal head can be provided.
YAMASHITA KIYOHARU
SAITO SHINJI
