To provide a ceramic polycrystal substrate and a glass ceramic substrate having smoothness of high precision to which a thin film device production technique of high precision, where a thin film with a film thickness of several nm to several μm is deposited, can be applied, and to provide a method for producing a thin film electronic component in which passive elements are formed on the substrate.
The method for producing a substrate for a thin film electronic component comprises: a stage where a first coating layer is formed on a ceramic polycrystal body or a glass ceramic body by the coating of a first raw material liquid, and the first coating layer is heated, so as to form a metal oxide thin film layer; and a stage where a second coating layer is formed on the surface of the metal oxide thin film layer by the coating of a second raw material liquid having viscosity relatively higher than that of the first raw material liquid, and the second coating layer is heated, so as to form a metal oxide thin film layer, and the metal oxide thin film layers are stacked, so as to form a coating layer composed of a metal oxide thin film with a film thickness of 0.1 to 20 μm.
ISHIGAMI HIDESATO
HAYASHI KATSUHIKO
Katsuhiro Imashita