Title:
SUBSTRATE TRANSFER DEVICE
Document Type and Number:
Japanese Patent JP2008290854
Kind Code:
A
Abstract:
To provide a substrate transfer device capable of reducing an occupied area specific to the transport device and realizing stable high speed transport which will not be effected by size increase/diversification of the substrate size.
The substrate transfer device comprises at least a stage 10, a wire supply head 20, a wire extension head 30, a first drive shaft 40 for moving the wire extension head 30 at right angles to the transfer direction for extending a wire, and second drive shafts 50a, 50b for moving the wire supply head 20 and the wire extension head 30 in the transfer direction.
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Inventors:
Shirata, Kenichiro
Matsumoto, Yasuaki
Matsumoto, Yasuaki
Application Number:
JP2007000138774
Publication Date:
December 04, 2008
Filing Date:
May 25, 2007
Export Citation:
Assignee:
TOPPAN PRINTING CO LTD
International Classes:
B65G49/06; B65G35/06; H01L21/677
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