PURPOSE: To make it possible to set arbitrarily a substrate transfer position outside of a substrate transfer device and to provide the miniaturized substrate transfer device.

CONSTITUTION: A substrate transfer device is constituted of a group 32 of substrate support pins, which consist of three support pins 31 and support a substrate W by the points 31a of the pins 31, a heat-treat-plate 33, which has through holes 33a to make each support pin 31 penetrate and supports the substrate W in a horizontal attitude, and a plurality of air cylinders 34 which vertically move the group 32. The group 32 are vertically moved by the air cylinders 34 in a direction Q, in which a prescribed acute angle α is made to the vertical direction, toward a substrate transfer position for delivering the substrate to a second transfer mechanism 23, whereby the transfer of the substrate W takes place between the mechanism 23 and the plate 33.