PURPOSE: To provide a substrate transfer tray which is able to protect substrates against damage or flaws liable to occur in transit, where the transfer tray houses substrates and is transferred from one station to another together with the substrates by a transfer means such as a belt conveyer or the like.

CONSTITUTION: An oval first recess 31 where a first semiconductor wafer 11 is nearly longitudinally housed and an oval second recess 32 where a second semiconductor wafer 12 smaller than the first wafer 11 is nearly longitudinally housed are provided to a semiconductor transfer tray. The inner side face 31a of the first recess 31 which supports the edge of the first semiconductor wafer 11 when the first semiconductor wafer 11 is housed is formed into a slope which spreads wide from its opening to the innermost as tapered, and the inner side face 32a of the second recess 32 which supports the edge of the second semiconductor wafer 12 when the first semiconductor wafer 12 is housed is formed into a slope which spreads wide from its opening to the innermost as tapered.