Title:
Substrate transport method in substrate dividing device and substrate dividing device
Document Type and Number:
Japanese Patent JP6365705
Kind Code:
B2
Inventors:
Hitoshi Nishio
Application Number:
JP2017033267A
Publication Date:
August 01, 2018
Filing Date:
February 24, 2017
Export Citation:
Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
C03B33/03; B28D5/00; B28D7/00; B65G15/28; B65G21/14; B65G47/52; H01L21/677
Domestic Patent References:
| JP35007159B1 | ||||
| JP48022157B1 | ||||
| JP49023269B1 | ||||
| JP2004026569A | ||||
| JP2007075964A | ||||
| JP2010095003A |