Title:
SUBSTRATE TREATING DEVICE
Document Type and Number:
Japanese Patent JP3680907
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To shorten the length of a pipeline for sending a processing soln. to a substrate treating part as much as possible and to provide a substrate treating device with enhanced versatility of the processing soln. feed line.
SOLUTION: This substrate treating device is provided with the coating units U1 to U4 and the photoresist soln. supply units 20a and 20b for supplying a processing soln. to the respective units U1 to U4. The units 20a and 20b are formed by loading resist bottles 22a and 22b, pumps 25a and 25b, etc., on a tray 21 capable of being pulled out of a device frame 5. Since the photoresist soln. feed line is provided to each coating unit, the pipeline 30 is shortened, the photoresist soln. supply units are easily increased or decreased in accordance with the number of the set coating units, and the versatility of the photoresist soln. feed line is enhanced.
Inventors:
Koichi Kageki
Masashi Maeda
Ryuichi Chikamori
Masashi Maeda
Ryuichi Chikamori
Application Number:
JP15263698A
Publication Date:
August 10, 2005
Filing Date:
June 02, 1998
Export Citation:
Assignee:
Dainippon Screen Mfg. Co., Ltd.
International Classes:
G03F7/16; B05C11/08; B05C11/10; H01L21/027; (IPC1-7): B05C11/10; B05C11/08; G03F7/16; H01L21/027
Domestic Patent References:
| JP9062009A |
Attorney, Agent or Firm:
Tsutomu Sugiya