Title:
SUBSTRATE TREATING DEVICE
Document Type and Number:
Japanese Patent JP3808072
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate treating device having a simplified configuration and capable of adjusting the temperature of a treatment liquid supplied to a substrate.
SOLUTION: Two or more nozzles 10 connecting to different kinds of treatment liquid pipes, are accommodated in a standby part 50 and at the same time, a nozzle grabbing part 20 capable of moving vertically and horizontally selects, grabs, and conveys the nozzle 10 to a predetermined position on the substrate W of a rotation processing part 1 and supplies the treatment liquid to the substrate W. The nozzle grabbing part 20 has a pair of pinching and holding arms to which a Peltier element has been attached. The treatment liquid pipe in the nozzle 10 is wound around a heat transmitting member having a grabbed part to be grabbed by the pinching and holding arms, the endothermic effect by the Peltier element of the nozzle grabbing part 20 is exerted on the treatment liquid pipe, and thus the treatment liquid in the treatment liquid pipe is adjusted to a predetermined temperature.
Inventors:
Yoichi Nishimura
Masami Otani
Yasuo Imanishi
Masao Tsuji
Yuki Iwami
Akihiko Morita
Takanori Kawamoto
Masami Otani
Yasuo Imanishi
Masao Tsuji
Yuki Iwami
Akihiko Morita
Takanori Kawamoto
Application Number:
JP2003406937A
Publication Date:
August 09, 2006
Filing Date:
December 05, 2003
Export Citation:
Assignee:
Dainippon Screen Mfg. Co., Ltd.
International Classes:
G03F7/16; H01L21/027; B05C11/08; B05C11/10; B08B3/02; B08B3/10; H01L21/304; (IPC1-7): H01L21/027; B05C11/08; B05C11/10; B08B3/02; B08B3/10; G03F7/16; H01L21/304
Domestic Patent References:
| JP62214621A | ||||
| JP2132444A | ||||
| JP9057176A | ||||
| JP6023239U |
Attorney, Agent or Firm:
Yoshito Fukushima