Title:
Substrate treating method
Document Type and Number:
Japanese Patent JP6015819
Kind Code:
B2
Abstract:
A substrate processing apparatus (FPA) comprises a supply roller (5b), a chamber (CB), and a collecting roller (6b). A flexible substrate (S) formed of a resin film or stainless steel foil is carried from the supply roller (5b) to the collecting roller (6b) through the chamber (CB), and is wound around the collecting roller (6b). In the chamber (CB), a liquid is applied to the substrate (S) using a transcription device (11). The supply roller (5b) moves along a first rail (3) extending in a direction (X) perpendicular to a direction (Y) in which the substrate (S) is carried. The collecting roller (6b) moves along a second rail (4) in synchronization with the supply roller (5b). Along with these movements, the substrate (S) is moved into and out of the chamber (CB). In a chamber (CB) of another apparatus (FPA2), the substrate (S) is processed using a plasma device (12).
More Like This:
| WO/2008/153671 | ROLL TOWEL DISPENSER |
| WO/2000/003086 | METHOD AND APPARATUS IN MOISTENING OF A WEB |
| WO/2000/003088 | METHOD AND APPARATUS FOR MANUFACTURING CALENDERED PAPER |
Inventors:
Tomohide Hamada
Toru Kiuchi
Toru Kiuchi
Application Number:
JP2015142284A
Publication Date:
October 26, 2016
Filing Date:
July 16, 2015
Export Citation:
Assignee:
NIKON CORPORATION
International Classes:
B65H20/00; B05B14/30; B65G49/00; G02F1/13; G03F7/20; H01L21/027; H01L21/677
Domestic Patent References:
| JP2000303178A | ||||
| JP59034668A | ||||
| JP2002035982A |
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Tadashi Takahashi
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