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Title:
SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD
Document Type and Number:
Japanese Patent JP2008130951
Kind Code:
A
Abstract:

To provide a substrate treatment apparatus and a substrate treatment method capable of cleaning a substrate surface with favorable thermal energy efficiency while preventing damage to the surface of the substrate.

A liquid film 11 is frozen in a state that the liquid film 11 is deposited on a substrate surface Wf to form a frozen film 13. Subsequently, a heated gas discharge nozzle 4 is swung along a movement locus T4 from the rotation center P41 of the substrate W toward the end edge P42 of the substrate W while a heated gas is locally discharged from the heated gas discharge nozzle 4 toward the surface Wf of the rotatively driven substrate W. Thus, a region (melted region), of the surface region of the substrate surface Wf where the frozen film 13 has been melted, spreads from the center of the substrate surface Wf to the circumferential edge, and the entire frozen film 13 formed on the substrate surface Wf is melted.


Inventors:
MIYA KATSUHIKO
FUJIWARA NAOZUMI
IZUMI AKIRA
Application Number:
JP2006316540A
Publication Date:
June 05, 2008
Filing Date:
November 24, 2006
Export Citation:
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Assignee:
DAINIPPON SCREEN MFG
International Classes:
H01L21/304; B08B3/10; B08B7/00; G02F1/13; G03F1/82
Attorney, Agent or Firm:
Kakusho Shoichi
Ryose Uji