Title:
SUBSTRATE TREATMENT APPARATUS
Document Type and Number:
Japanese Patent JP3739225
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent the contamination of the back of a substrate without performing the drying treatment of the substrate in a contaminated atmosphere of a chemical soln. contained in a washing soln.
SOLUTION: A motor 3 for rotating the spin base 5 having the surface opposed to the under surface of a wafer W to support the wafer W when the wafer W is supported in such a state that the under surface of the wafer W is allowed to be spaced apart from the opposed surface, a lower washing nozzle 29 for supplying a washing soln. to the under surface of the wafer W supported on the spin base 5, a side part washing nozzle 23 for supplying pure water different from the washing soln. to the space between the opposed surface of the spin base 5 and the under surface of the wafer W supported on the spin base 5 from the lateral side of the spin base 5 after the supply of the washing soln. to the under surface of the wafer W by the lower washing nozzle 29 are provided to a substrate treatment apparatus. Therefore, the opposed surface of the spin base 5 can be washed and the contamination of the under surface of the substrate W can be prevented without performing drying treatment in a contaminated atmosphere of the chemical soln. contained in the washing soln.
Inventors:
Akira Izumi
Katsuhiko Miya
Koji Ando
Katsuhiko Miya
Koji Ando
Application Number:
JP36523098A
Publication Date:
January 25, 2006
Filing Date:
December 22, 1998
Export Citation:
Assignee:
Dainippon Screen Mfg. Co., Ltd.
International Classes:
B08B3/08; H01L21/304; (IPC1-7): B08B3/08; H01L21/304
Domestic Patent References:
| JP9330904A | ||||
| JP10199852A | ||||
| JP5259060A |
Attorney, Agent or Firm:
Ryose Uji
Kakusho Shoichi
Kakusho Shoichi