Title:
SUBSTRATE TREATMENT APPARATUS
Document Type and Number:
Japanese Patent JP3846773
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus realizing the optimum treatment state by providing a rectifying member controlled so as to rise and fall at the time of treatment of a substrate.
SOLUTION: In the substrate treatment apparatus 2, the substrate W is held on a rotary support plate 21 and subjected to rotary treatment in the treatment space S formed between an upper rotary plate 41 and the rotary support plate 21 so as to hold the substrate W. The upper surface of the rotary support plate 21 has a projection 211 and the projection 211 is fitted in the recessed projection 430 to support the rectifying member 400. A lift drive mechanism 450 is arranged to the side part of the rectifying member 400 and the rod 454 of a cylinder 453 is extended and contacted to control the rectifying member 400 so as to raise and lower the same.
Inventors:
Hiroyuki Kitazawa
Application Number:
JP2000381260A
Publication Date:
November 15, 2006
Filing Date:
December 15, 2000
Export Citation:
Assignee:
Dainippon Screen Mfg. Co., Ltd.
International Classes:
B05C11/08; G03F7/40; B05C11/10; G03F7/42; H01L21/304; H01L21/306; (IPC1-7): B05C11/08; B05C11/10; H01L21/304; H01L21/306; //G03F7/40; G03F7/42
Domestic Patent References:
| JP9139341A | ||||
| JP9290198A | ||||
| JP63091166A | ||||
| JP2000246163A | ||||
| JP11179264A |
Attorney, Agent or Firm:
Kakusho Shoichi
Ryose Uji
Ryose Uji
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