Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SUBSTRATE TREATMENT DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2011068966
Kind Code:
A
Abstract:

To provide a substrate treatment device in which footprint can be suppressed.

The substrate treatment device includes: a substrate holder holding a substrate; an ion source generating ions; a target irradiated with ions generated from the ion source; a rotary shaft arranged in such a manner that the substrate holder is located in the elongating direction of the shaft; a plurality of elongating parts elongating to directions vertical to the rotary shaft and also to the different directions; target chucks respectively provided at the elongating parts and holding each target in such a manner that the distance between the rotary shaft and the target is shortened as it is made close to the substrate holder side; and a rotary device rotating the rotary shaft.


Inventors:
Hara, Daisuke
Niimura, Norihiro
Murobayashi, Masasue
Natsui, Kenichi
Application Number:
JP2009000222262
Publication Date:
April 07, 2011
Filing Date:
September 28, 2009
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HITACHI KOKUSAI ELECTRIC INC
International Classes:
C23C14/46; H01L21/8246; H01L27/105; H01L43/08; H01L43/12